Design Capabilities (DC to mm-Wave)

• Power Amplifiers (high efficiency, broadband, low/mid/high power, low distortion, bi-directional, BALUN development, linearization, temperature compensation, adaptable matching, envelope tracking, efficiency enhancement, miniaturized)

• Class AB, B, C, E, F, J designs
• System, MMIC, die level (discreet or chip & wire)
• Integrated with other hardware

• Receivers and Converters (LNAs, low-loss pre-selection, block and discreet conversion, filtering, AGC/ALC circuits, etc.)

• Communications Architecture, Transmitters, Jamming Scenarios, Interference Cancellation and Mitigation, Direction-Finding and Tracking Systems (Outdoors and Indoors), Sensor development

• System Design/Analysis/Complex Systems: Link Budgets, Power Budgets, Reliability, Radiation, Maintainability, End Of Life Degradation, identifying proper modulation for specialized needs

• Rugged environments, EMC/EMI/TEMPEST/MIL-STD-461, MIL-STD-810C, specialized environments: high-pressure, extreme temperature, space environment, unsafe, difficult or First-Responder environments

• Type of payloads: UAV, Drone, Aircraft, Ship/Boat, Under-Water, Space, Ground, Vehicle, Man-pack, First-Responder, Commercial Applications

• Specialized Packaging to meet miniaturized, very low power, low weight, or long-lasting designs

• Quick-React Capability